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Mission
Mission
Research: CMOS Analog Integrated Circuit (IC) Design:
AI-assisted troubleshooting of hardware and ICs: PCB level and chip level: embedding virtual expert knowledge
Secure ADC design: Side-channel analysis and countermeasures for SAR analog-to-digital converter (ADC) circuits
Hardware foundations for cybersecurity, such as zero-trust and cybersecurity mesh architecture (CSMA)
Education: debugging education, semiconductor workforce development in response to the Chips and Science Act (2022).
GRA Hiring
GRA Hiring
We are looking for prospective PhD students to join our group in 2026! Please email me for details.
News
News
08/2025: [Honor] John Hu was named as Lynn T. Miller Faculty Fellow. OSU News.
08/2025: [Paper] One paper accepted at IEEE Open Journal of Circuits and Systems (OJCAS). (link)
08/2025: [Graduation] Nipun Kaushik successfully defended his PhD dissertation. Congratulations, Dr. Kaushik!
06/2025: [Award] Andrew Ash won the 2025 Jake Karrfalt Best Student Paper Award at the 34th IEEE Microelectronics Design & Test Symposium (MDTS) in Albany, NY, USA. (link)
06/2025: [Funding] NSF: RET Site: Photonic Microchip Fabrication Experiences for Oklahoma Educators (Co-PI) OSU News.
05/2025: [Paper] Two papers accepted at IEEE Frontiers in Education (FIE) 2025. (link1) (link2)
03/2025: [Award] John Hu named one of the 2025 DaVinci Fellows by the DaVinci Institute, Oklahoma's Creativity Think Tank. OSU News.
03/2025: [Paper/Poster] One paper and two posters at ASEE 2025. (link1) (link2) (link3)
02/2025: [Paper] An invited paper at IEEE Microelectronics Design & Test Symposium (MDTS) 2025. (link)
01/2025: [Paper] One paper at IEEE ISCAS 2025. (link)
08/2024: [Funding] NASA: Rapid Response Research (R3): RFA-037: Exploring the Network and Computation Foundations for Cybersecurity Mesh Architecture (CSMA), SMD (Co-I/Science-PI). OSU CEAT News.
07/2024: [Paper] One paper at IEEE Frontiers in Education (FIE) 2024. (link)
04/2024: [Paper/Poster] One paper and three posters at ASEE 2024. (link1), (link2), (link3), (link4)
01/2024: [Paper/Poster] One paper and one poster at IEEE ISCAS 2024. (link1), (link2)
09/2023: [Outreach] Science Cafe: Promoting Semiconductor Research and Education with Oklahoma STEM Teachers. (YouTube)
08/2023: [Funding] NSF: An Individual Investigator Development Plan to Improve Undergraduate Debugging Skills and Mindset. (PI)
08/2023: [Honor] John Hu was selected as a Jack H. Graham Endowed Fellow of Engineering.
06/2023: [Poster] One paper on radiation hardened by design (RHBD) comparator at IEEE MWSCAS. (link)
04/2023: [Demo] Hardware demo by undergraduate students at IEEE International Symposium on Hardware-Oriented Security and Trust (HOST).
10/2022: [Funding] Oklahoma NASA EPSCoR office: Radiation Hardened Analog VLSI for Space Scientific Instruments. (PI)
10/2022: [Funding] NASA: Rapid Assured Fully Transparent IC Physical Design Capability. (Co-PI)
07/2022: [Funding] NSF: RET Site: Chip Design Experiences for Teachers to Stimulate Semiconductor Education in Oklahoma. (PI)
04/2021: [Paper] One paper at IEEE MWSCAS (link)
01/2021: [Paper] Two papers at IEEE ISCAS. (link1), (link 2)
Batteryless Energy Harvesting (RAISE)
Batteryless Energy Harvesting (RAISE)
Team 1: Field Test: Extracting energy using TEG. BLE Radio. Sensors
Team 1: Field Test: Extracting energy using TEG. BLE Radio. Sensors
Team Member (alphabetical order): Anfal Hussain, Aaron J. Sosa, Ryan Vaughan.
A thermoelectric generator (TEG) can harvest energy from the temperature differences between the soil surface and shallow ground. When tested in April in Oklahoma, the TEG generates 10~40 mV of stable DC voltage. Bluetooth Low Energy (BLE) protocol can be used to send data. The relationship between the duty cycle and system power consumption was explored. Moisture & humidity sensors were also implemented.
Sponsor: Renewable and Innovative Sustainable Energy (RAISE): Martin Family Foundation (MFF) Fund.
Batteryless Energy Harvesting (RAISE)
Batteryless Energy Harvesting (RAISE)
Team 2: DC-DC Boost Converter Design & Test. MCU. Electronics Test
Team 2: DC-DC Boost Converter Design & Test. MCU. Electronics Test
Team Member (alphabetical order): Agustin Garcia, Chester Stubbs, Jame Ming Tan
A flyback ("Boost") converter was designed and tested using a commercial off-the-shelf IC (MCRY12) and 1:50 transformer. It can boost up to 1V of DC voltage when the TEG input voltage is around 20 mV. The Boost converter PCB measures about 0.5 square inches (or 2 cm²), compact enough to be integrated with the TEG and the copper rod.
Sponsor: Renewable and Innovative Sustainable Energy (RAISE): Martin Family Foundation (MFF) Fund.
2021 Kicker Design Competition
2021 Kicker Design Competition
ECEN 5363 (Mixed-Signal IC Design) and ECEN 3714 (Network Analysis) held a joint student design contest in Fall 2021. The winners are:
Best Design: "A Dynamic Bias Comparator Design and Layout with Performance Simulations" by Fahim Hossain, Sam Fellwock.
People's Choice: "Side-Channel Attack with ChipWhisperer" by Christian Moser.
The contest was sponsored and judged by Kicker, a high-performance audio company headquartered in Stillwater, OK.
Here is a graduate student presentation during ECEN 5363: Mixed-Signal IC Design.
Introduction to Convolutional Neural Network
We have created our YouTube Channel to facilitate stay-at-home learning.
Here is a clip from our ECEN 4010: Mixed-Signal Electronics: student presentation
Software Defined Radio: Live Demo in Stillwater, OK
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